Chip packaging structure, preparation method of chip packaging structure and physical quantity measuring device

The invention relates to a chip packaging structure, a preparation method of the chip packaging structure and a physical quantity measuring device. The chip packaging structure comprises a substrate, a chip, a first metal bonding pad, a second metal bonding pad, a first metal wire and a packaging la...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	TAZUKI YU, ZHANG XIU, HOU CHANG, QIU YUANHONG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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