Chip packaging structure, preparation method of chip packaging structure and physical quantity measuring device

The invention relates to a chip packaging structure, a preparation method of the chip packaging structure and a physical quantity measuring device. The chip packaging structure comprises a substrate, a chip, a first metal bonding pad, a second metal bonding pad, a first metal wire and a packaging layer, the chip is located on the substrate; the first metal bonding pad is located on the substrate or the chip; the second metal bonding pad is located on the substrate or the chip; one end of the first metal wire is fixedly connected with the first metal pad, and the other end is fixedly connected with the second metal pad; the packaging layer is located above the substrate and wraps the chip, the first metal bonding pad, the second metal bonding pad and the first metal wire; the first metal wire is used for measuring physical quantity. According to the technical scheme provided by the invention, physical quantity measurement of the chip packaging structure can be realized on the premise of not changing the chip d