Wire-clamping-free mold and power adapter shell manufacturing method
The invention relates to the technical field of dies, and particularly discloses a wire-clamping-free die and a power adapter shell manufacturing method.The wire-clamping-free die comprises an upper die plate and a lower die plate, the upper die plate is provided with an upper die core, the lower di...
Gespeichert in:
Hauptverfasser: | , , , , , , |
---|---|
Format: | Patent |
Sprache: | chi ; eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | The invention relates to the technical field of dies, and particularly discloses a wire-clamping-free die and a power adapter shell manufacturing method.The wire-clamping-free die comprises an upper die plate and a lower die plate, the upper die plate is provided with an upper die core, the lower die plate is provided with a lower die core, the lower die core is provided with a first groove, and the lower die core is provided with an insert; the insert is located in the first groove and penetrates through the lower mold core in an up-down movable mode, a second groove is formed in the upper mold core, when the upper mold plate and the lower mold plate are closed, a forming mold cavity of the power adapter shell is defined by the groove face of the first groove, the side wall of the insert and the groove face of the second groove, and the lower mold plate is provided with a driving mechanism. The driving mechanism is used for driving the insert to vertically move up and down, the lower mold core is provided wi |
---|