Epoxy resin composition for sealing and electronic device
Provided are an electronic device and an epoxy resin composition for sealing, which have high storage stability and are capable of improving the curing speed during curing. This epoxy resin composition for sealing contains an epoxy resin (A), a curing agent (B), a curing accelerator (C), and an inor...
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| creator | FUJIWARA HISAYUKI MAEDA YASUAKI OGAWA KAZUTO |
| description | Provided are an electronic device and an epoxy resin composition for sealing, which have high storage stability and are capable of improving the curing speed during curing. This epoxy resin composition for sealing contains an epoxy resin (A), a curing agent (B), a curing accelerator (C), and an inorganic filler (D). The curing accelerator (C) contains an amidine silicate (Cl) represented by formula (1). # imgabs0 #
提供了一种电子装置和密封用环氧树脂组合物，所述密封用环氧树脂组合物具有高贮存稳定性并且能够提高固化期间的固化速度。该密封用环氧树脂组合物含有环氧树脂(A)、固化剂(B)、固化促进剂(C)和无机填料(D)。固化促进剂(C)含有由式(1)表示的脒硅酸盐(Cl)。#imgabs0# |
| format | Patent |
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提供了一种电子装置和密封用环氧树脂组合物，所述密封用环氧树脂组合物具有高贮存稳定性并且能够提高固化期间的固化速度。该密封用环氧树脂组合物含有环氧树脂(A)、固化剂(B)、固化促进剂(C)和无机填料(D)。固化促进剂(C)含有由式(1)表示的脒硅酸盐(Cl)。#imgabs0#</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; SEMICONDUCTOR DEVICES ; THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20241105&DB=EPODOC&CC=CN&NR=118900868A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20241105&DB=EPODOC&CC=CN&NR=118900868A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>FUJIWARA HISAYUKI</creatorcontrib><creatorcontrib>MAEDA YASUAKI</creatorcontrib><creatorcontrib>OGAWA KAZUTO</creatorcontrib><title>Epoxy resin composition for sealing and electronic device</title><description>Provided are an electronic device and an epoxy resin composition for sealing, which have high storage stability and are capable of improving the curing speed during curing. This epoxy resin composition for sealing contains an epoxy resin (A), a curing agent (B), a curing accelerator (C), and an inorganic filler (D). The curing accelerator (C) contains an amidine silicate (Cl) represented by formula (1). # imgabs0 #
提供了一种电子装置和密封用环氧树脂组合物，所述密封用环氧树脂组合物具有高贮存稳定性并且能够提高固化期间的固化速度。该密封用环氧树脂组合物含有环氧树脂(A)、固化剂(B)、固化促进剂(C)和无机填料(D)。固化促进剂(C)含有由式(1)表示的脒硅酸盐(Cl)。#imgabs0#</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLB0LcivqFQoSi3OzFNIzs8tyC_OLMnMz1NIyy9SKE5NzMnMS1dIzEtRSM1JTS4pys_LTFZISS3LTE7lYWBNS8wpTuWF0twMim6uIc4euqkF-fGpxQWJyal5qSXxzn6GhhaWBgYWZhaOxsSoAQBeBy7x</recordid><startdate>20241105</startdate><enddate>20241105</enddate><creator>FUJIWARA HISAYUKI</creator><creator>MAEDA YASUAKI</creator><creator>OGAWA KAZUTO</creator><scope>EVB</scope></search><sort><creationdate>20241105</creationdate><title>Epoxy resin composition for sealing and electronic device</title><author>FUJIWARA HISAYUKI ; MAEDA YASUAKI ; OGAWA KAZUTO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN118900868A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2024</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><toplevel>online_resources</toplevel><creatorcontrib>FUJIWARA HISAYUKI</creatorcontrib><creatorcontrib>MAEDA YASUAKI</creatorcontrib><creatorcontrib>OGAWA KAZUTO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>FUJIWARA HISAYUKI</au><au>MAEDA YASUAKI</au><au>OGAWA KAZUTO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Epoxy resin composition for sealing and electronic device</title><date>2024-11-05</date><risdate>2024</risdate><abstract>Provided are an electronic device and an epoxy resin composition for sealing, which have high storage stability and are capable of improving the curing speed during curing. This epoxy resin composition for sealing contains an epoxy resin (A), a curing agent (B), a curing accelerator (C), and an inorganic filler (D). The curing accelerator (C) contains an amidine silicate (Cl) represented by formula (1). # imgabs0 #
提供了一种电子装置和密封用环氧树脂组合物，所述密封用环氧树脂组合物具有高贮存稳定性并且能够提高固化期间的固化速度。该密封用环氧树脂组合物含有环氧树脂(A)、固化剂(B)、固化促进剂(C)和无机填料(D)。固化促进剂(C)含有由式(1)表示的脒硅酸盐(Cl)。#imgabs0#</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP |
| title | Epoxy resin composition for sealing and electronic device |
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