Epoxy resin composition for sealing and electronic device

Provided are an electronic device and an epoxy resin composition for sealing, which have high storage stability and are capable of improving the curing speed during curing. This epoxy resin composition for sealing contains an epoxy resin (A), a curing agent (B), a curing accelerator (C), and an inor...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	FUJIWARA HISAYUKI, MAEDA YASUAKI, OGAWA KAZUTO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	Provided are an electronic device and an epoxy resin composition for sealing, which have high storage stability and are capable of improving the curing speed during curing. This epoxy resin composition for sealing contains an epoxy resin (A), a curing agent (B), a curing accelerator (C), and an inorganic filler (D). The curing accelerator (C) contains an amidine silicate (Cl) represented by formula (1). # imgabs0 # 提供了一种电子装置和密封用环氧树脂组合物，所述密封用环氧树脂组合物具有高贮存稳定性并且能够提高固化期间的固化速度。该密封用环氧树脂组合物含有环氧树脂(A)、固化剂(B)、固化促进剂(C)和无机填料(D)。固化促进剂(C)含有由式(1)表示的脒硅酸盐(Cl)。#imgabs0#