Packaging structure of photoelectric coupler and photoelectric coupler

Packaging structure of photoelectric coupler and photoelectric coupler

The photoelectric coupler packaging structure comprises a plurality of packaging units, and any packaging unit comprises a first base island, a second base island, a third base island and a fourth base island; a light receiving chip, an edge block and a light emitting chip are placed on the fourth b...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: LI YURONG, MAI JIA'ER, YU XIAOPENG, ZHU MINGJUN, YANG LU, LEI GUOWEN, ZHANG GUANGTIAN, ZHONG SHIQIN
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:The photoelectric coupler packaging structure comprises a plurality of packaging units, and any packaging unit comprises a first base island, a second base island, a third base island and a fourth base island; a light receiving chip, an edge block and a light emitting chip are placed on the fourth base island, the lower surface of the light receiving chip is bonded on the upper surface of the fourth base island, the lower surface of the edge block is bonded on the upper surface of the light receiving chip, and the lower surface of the light emitting chip is bonded on the upper surface of the edge block; the light receiving chip and the light emitting chip comprise a first electrode and a second electrode, the first electrode of the light receiving chip is connected with the fourth base island, the second electrode of the light receiving chip is connected with the third base island, the first electrode of the light emitting chip is connected with the first base island, and the second electrode of the light emi