High-efficiency photoelectric sensor packaging device

The invention belongs to the field of photoelectric sensor packaging devices, and particularly relates to a high-efficiency photoelectric sensor packaging device which comprises a device body, a buffer structure is arranged in the device body, and a packaging device is arranged on the upper surface...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: CHEN KUNSU, DENG ZHICAI
Format: Patent
Sprache:chi ; eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:The invention belongs to the field of photoelectric sensor packaging devices, and particularly relates to a high-efficiency photoelectric sensor packaging device which comprises a device body, a buffer structure is arranged in the device body, and a packaging device is arranged on the upper surface of the buffer structure. A stripping structure is arranged on the inner wall of the packaging device, the buffer structure comprises a motor, the motor is arranged on the surface of a device body, the output end of the motor penetrates through the surface of the device body and is rotationally connected with one end of a double-thread threaded rod, and the other end of the double-thread threaded rod is arranged on the inner wall of the device body. According to the high-efficiency photoelectric sensor packaging device, when the sealing pressure of the packaging device needs to be changed, a motor is started, so that the motor drives a double-end threaded rod to rotate, a moving block moves, a hard spring is extrude