Wiring substrate and light-emitting substrate

The invention provides a wiring substrate and a light-emitting substrate, and the wiring substrate comprises a substrate which comprises a first region and a fan-out region; each signal line comprises a first part located in the first region and a second part located in the fan-out region; the first...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: XU JIAWEI, ZHANG XIAOXIANG, LI YOULU, WANG BING, XU ZOUMING
Format: Patent
Sprache:chi ; eng
Schlagworte:
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Beschreibung
Zusammenfassung:The invention provides a wiring substrate and a light-emitting substrate, and the wiring substrate comprises a substrate which comprises a first region and a fan-out region; each signal line comprises a first part located in the first region and a second part located in the fan-out region; the first protection layer comprises a plurality of openings; an additional conductive portion; the plurality of openings comprise at least one of a first opening and a second opening; the first opening is located in the fan-out area and the second opening is located in the first area; the plurality of additional conductive parts comprise at least one of a first additional conductive part and a second additional conductive part; the first additional conductive portion is electrically connected to the signal line at the first opening, and the second additional conductive portion is electrically connected to the signal line at the second opening. 本公开提供了布线基板及发光基板,布线基板包括:衬底基板,包括:第一区,扇出区;多条信号线,信号线包括:位于第一区的第一部分,以及位于扇出区的第二部分;第一保护层