Cerium oxide-based slurry composition for selective and non-selective CMP of silicon oxide, silicon nitride and polysilicon

The present invention provides a chemical mechanical polishing composition comprising: (a) cerium oxide abrasive particles; (b) a cationic polymer; (c) a buffer solution; and (d) water, wherein the polishing composition has a pH of from about 6 to about 9. The invention also provides a method of che...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	CHANG JU-YEON, REISS BRIAN, HUANG HELIN, KIM SUNG WOO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS POLISHES POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH SEMICONDUCTOR DEVICES SKI WAXES
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