Semiconductor device

Provided is a semiconductor device in which resin is sufficiently filled between a lead frame and a metal plate for heat dissipation. The semiconductor device includes: a heat sink; a die pad provided on an upper side of the heat sink so as to be separated from the heat sink; a power chip provided on the surface of the chip pad on the opposite side from the surface facing the heat sink; and a molding resin that encapsulates a part of the heat sink, the chip pad, and the power chip, the surface of the heat sink facing the chip pad includes a flow promoting portion in a region overlapping the chip pad and not overlapping the power chip, and the flow promoting portion is formed so as to be away from a plane including the chip pad. 提供在引线框与散热用金属板之间充分地填充有树脂的半导体装置。半导体装置具有：散热器；芯片焊盘，其与散热器分离地设置于散热器的上侧；功率芯片，其设置于芯片焊盘的与散热器相对的面的相反侧的面；以及模塑树脂，其将散热器的一部分、芯片焊盘及功率芯片封装，散热器的与芯片焊盘相对的面在与芯片焊盘重叠且不与功率芯片重叠的区域包含流动促进部，该流动促进部是以远离包含芯片焊盘的平面的方式形成的。