Electronic module having wedge-wedge bonded structure not made of solid metal material as electrical connection element

The invention discloses an electronic module comprising one or more components, each component consisting of: a first electronic component having a first contact surface on which a first end of an initially free structure that is not made of a solid metal material is wedged, and a second electronic component having a second contact surface on which a second end of an initially free structure that is not made of a solid metal material is wedged; and a second electronic component having a second contact surface on which a second end of the initially free structure not made of the solid metal material is wedged, wherein the initially free structure not made of the solid metal material is either (i) in the form of a belt made of warp-knitted, weft-knitted, woven or woven fine metal wires and having a cross-sectional area in the range of 25,000 [mu] m2 to 800,000 [mu] m2, or (ii) in the form of a belt made of twisted fine metal wires and having a cross-sectional area in the range of 8,000 [mu] m2 to 600,000 [mu] m