Feeding device for semiconductor laser chip processing and feeding method thereof

The invention relates to the technical field of semiconductor laser chips, and discloses a feeding device for semiconductor laser chip processing and a feeding method thereof.The feeding device comprises a bottom plate, a positioning plate is fixedly connected to the top of the bottom plate, a motor...

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Bibliographische Detailangaben
Hauptverfasser: DING YANQI, KUAI DUOYAO, SHI HONGJIN, XIANG QINGZHI, LIU XIUXIU
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention relates to the technical field of semiconductor laser chips, and discloses a feeding device for semiconductor laser chip processing and a feeding method thereof.The feeding device comprises a bottom plate, a positioning plate is fixedly connected to the top of the bottom plate, a motor is fixedly connected to the surface of the positioning plate, and a belt is arranged at the output end of the motor; the surface of the positioning plate is fixedly connected with a machining device. The discharging part is arranged above the bottom plate, after semiconductor laser chips are placed in the discharging part, the discharging part starts to work, the semiconductor laser chips are discharged to the top of the conveying part one by one, after a motor is powered on, the motor drives the conveying part to start to work through connection of a belt wheel and a belt, and the conveying part is driven to work through the motor. The conveying part can convey the semiconductor laser chip to the machining positi