Method for manufacturing contacts of semiconductor device using devices having at least one plasma preprocessing cabin

A semiconductor substrate with a contact hole is loaded into a transfer apparatus containing a plasma pretreatment module and a deposition module connected together. The substrate is transferred to the plasma pretreatment module, for ashing photoresist pattern and removing bottom layer of the contac...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	CHI GYONG-KOO, KIM CHI-SOO, CHONG SOONG-PIL
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!