Method for manufacturing contacts of semiconductor device using devices having at least one plasma preprocessing cabin

Method for manufacturing contacts of semiconductor device using devices having at least one plasma preprocessing cabin

A semiconductor substrate with a contact hole is loaded into a transfer apparatus containing a plasma pretreatment module and a deposition module connected together. The substrate is transferred to the plasma pretreatment module, for ashing photoresist pattern and removing bottom layer of the contac...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: CHI GYONG-KOO, KIM CHI-SOO, CHONG SOONG-PIL
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A semiconductor substrate with a contact hole is loaded into a transfer apparatus containing a plasma pretreatment module and a deposition module connected together. The substrate is transferred to the plasma pretreatment module, for ashing photoresist pattern and removing bottom layer of the contact hole. The substrate is cleaned and transferred to vacuum deposition module for filling with a depositing material.