Structure, method and process facilitating wafer scribing

The invention discloses a structure, a method and a process for facilitating wafer scribing, and the structure comprises the steps: determining a wafer scribing boundary in an XY plane of the front surface of a wafer along a horizontal crystal orientation and a vertical crystal orientation; first ar...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	ZHAN TONGZHOU, WANG AO, SHI YANLI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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