Structure, method and process facilitating wafer scribing

The invention discloses a structure, a method and a process for facilitating wafer scribing, and the structure comprises the steps: determining a wafer scribing boundary in an XY plane of the front surface of a wafer along a horizontal crystal orientation and a vertical crystal orientation; first arrow grooves arranged in a linear array are formed along the horizontal crystal orientation boundary of the wafer; forming second arrow grooves arranged in a linear array along the vertical crystal orientation boundary of the wafer; and carrying out implicit cutting scribing on the wafer along the first arrow groove and the second arrow groove. The arrow groove and the scribing groove are formed in the front face or the back face of the wafer according to the characteristic difference of the horizontal crystal orientation material and the vertical crystal orientation material, through the structure, the method and the technology, in the hidden cutting process of the wafer, the hidden cutting stress of the upper face