Adhesive composition and film

Provided are: an adhesive composition which can be suitably used as a UV-release adhesive for semiconductor processing and which has excellent heat resistance; and a film sheet. An adhesive composition constituting the adhesive layer (11) contains (A) an alkyl (meth) acrylate having a C1-C18 alkyl g...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SUZUKI FUMIE, NAGAKURA TAKESHI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!