Adhesive composition and film

Provided are: an adhesive composition which can be suitably used as a UV-release adhesive for semiconductor processing and which has excellent heat resistance; and a film sheet. An adhesive composition constituting the adhesive layer (11) contains (A) an alkyl (meth) acrylate having a C1-C18 alkyl group, (B) a copolymerizable nitrogen-containing vinyl monomer that is a copolymerizable monomer that does not contain a carboxyl group, and (C) a (meth) acrylic polymer having a weight-average molecular weight of 1,000,000 to 3,000,000 and containing a copolymerizable monomer that contains a hydroxyl group. At least one selected from the group consisting of (D) acrylates having four or more unsaturated double bonds in the molecule; (E) 0.1-10 parts by weight of a trifunctional or higher aromatic isocyanate compound per 100 parts by weight of the total of (A) and (B); (F) 0.1 to 3 parts by weight of a silane coupling agent; and (G) 0.1 to 5.0 parts by weight of a photoinitiator. 提供一种能够适合用作半导体加工用UV剥离粘合剂且耐热性优异的粘合剂组合物以