Thermal management assembly including expandable material

Described is a thermal management assembly comprising: a first thermal path comprising a first expandable material disposed between a first electrochemical cell and a first heat exchange member; and a second thermal path comprising a second expandable material disposed between the second electrochem...

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Bibliographische Detailangaben
Hauptverfasser: FREY MATTHEW H, CARPENTER SAMUEL J, HO VICTOR, JOHNSON MATTHEW T, BARTLING BRANDON A, BOURQUE ALEXANDER J, JIN ZHOU, PODKAMINA, JACOB, P, DUNHAM, MARK, T
Format: Patent
Sprache:chi ; eng
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Zusammenfassung:Described is a thermal management assembly comprising: a first thermal path comprising a first expandable material disposed between a first electrochemical cell and a first heat exchange member; and a second thermal path comprising a second expandable material disposed between the second electrochemical cell and the second heat exchange member. The first expandable material and the second expandable material independently include expandable particles dispersed in an organic binder, and the first expandable material and the second expandable material expand in a first expansion temperature range and a second expansion temperature range, respectively. Methods of using the thermal management assembly and methods of making the thermal management assembly are also described. 描述了一种热管理组件,该热管理组件包括:第一热路径,该第一热路径包括设置在第一电化学电池与第一热交换构件之间的第一可膨胀材料;和第二热路径,该第二热路径包括设置在第二电化学电池与第二热交换构件之间的第二可膨胀材料。该第一可膨胀材料和该第二可膨胀材料独立地包括分散在有机粘结剂中的膨胀型颗粒,并且该第一可膨胀材料和该第二可膨胀材料分别在第一膨胀温度范围和第二膨胀温度范围中膨胀。还描述了使用热管理组件的方法和制造热管理组件的方法。