High-power thick-film three-dimensional stacked power supply module and device

The invention belongs to the technical field of integrated power supplies, and discloses a high-power thick-film three-dimensional stacked power supply module and device. The high-power thick-film three-dimensional stacked power module comprises a metal shell, a lower-layer LTCC substrate, an upper-...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	HUA MING, FENG XINGE, WU ZHIHUI, XIA AIQING, LIU JING, ZHU YONGLIANG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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