High-power thick-film three-dimensional stacked power supply module and device

The invention belongs to the technical field of integrated power supplies, and discloses a high-power thick-film three-dimensional stacked power supply module and device. The high-power thick-film three-dimensional stacked power module comprises a metal shell, a lower-layer LTCC substrate, an upper-layer LTCC substrate, an upper-layer LTCC substrate surface-mounted device, a lower-layer LTCC substrate front surface-mounted device and a lower-layer LTCC substrate back surface-mounted device. According to the invention, the problems of single-layer tiled layout and single-layer layout of devices commonly used by the current thick-film hybrid integrated circuit power supply module are solved, and the problems of poor leakproofness of a large shell of the hybrid integrated power supply module with high output power, increased risk of thermal mismatch between a substrate and the shell, increased shell deformation, low space utilization rate and the like are improved; in a high-power occasion, a multi-layer three-d