Wafer bonding system and thermocompression bonding, direct bonding and anodic bonding methods

The invention relates to a wafer bonding system and thermocompression bonding, direct bonding and anodic bonding methods, and belongs to the technical field of semiconductor devices. The wafer bonding system comprises a first bonding module, a second bonding module, a transfer channel, a wafer loading and unloading area, a pre-positioning module, a cooling module, a plasma activation module and a cleaning module. The wafer thermocompression bonding, plasma activation direct bonding and anodic bonding processes can be supported at the same time, space resources are greatly saved through the layout design, and flexible adjustment can be conveniently carried out according to production requirements; the single transfer robot reciprocates in the transfer channel along the linear guide rail, so that high-efficiency transfer of wafers is realized, and equipment cost and energy consumption and human input in an operation process are reduced; and meanwhile, the wafer loading and unloading area can manage the upper wa