Compensation method for wafer bonding

The invention provides a compensation method for wafer bonding, which comprises the following steps: bonding a first wafer and a second wafer, the first wafer comprising a first conductive gasket and a second conductive gasket; performing a first coverage check; confirming whether a result of the fi...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	YANG TIANZHU, YANG JINCHENG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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