Compensation method for wafer bonding

The invention provides a compensation method for wafer bonding, which comprises the following steps: bonding a first wafer and a second wafer, the first wafer comprising a first conductive gasket and a second conductive gasket; performing a first coverage check; confirming whether a result of the first coverage check meets a first predetermined criterion; if the result of the first coverage check does not conform to the first predetermined criterion, performing a first compensation method to form a compensated first wafer and a compensated second wafer, the position of the first conductive pad of the compensated first wafer being different from the position of the first conductive pad of the first wafer, and the position of the compensated second conductive gasket of the first wafer is different from the position of the second conductive gasket of the first wafer. 本公开提供了一种晶圆接合的补偿方法，包括接合第一晶圆和一第二晶圆，该第一晶圆包括第一导电垫片和第二导电垫片；执行第一覆盖检查；确认第一覆盖检查的结果是否合乎第一预定标准；若第一覆盖检查的结果不合乎第一预定标准，执行第一补偿方法以形成补偿的第一晶圆和补偿的第二晶圆，其中补偿的第一晶圆的第一导电垫