Thin film capacitor, method for manufacturing same, and electronic circuit board provided with thin film capacitor
The present invention provides a thin film capacitor in which a pair of terminal electrodes can be arranged on the same surface. A thin-film capacitor (1) provided with: a metal foil (10) having an unroughened central portion (13) and a roughened upper surface (11); a dielectric film (D) covering th...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The present invention provides a thin film capacitor in which a pair of terminal electrodes can be arranged on the same surface. A thin-film capacitor (1) provided with: a metal foil (10) having an unroughened central portion (13) and a roughened upper surface (11); a dielectric film (D) covering the roughened upper surface (11) of the metal foil (10); an electrode layer (31) in contact with the unroughened central portion (13) of the metal foil (10) via an opening provided in the dielectric film (D); and the dielectric film (D). And an electrode layer (32) that is in contact with the metal foil (10) but not in contact with the metal foil (10). The thickness (T1) of the center portion (13) of the metal foil (10) at a position overlapping the electrode layer (31) is greater than the thickness (T2) at a position overlapping the electrode layer (32).
本发明提供能够将一对端子电极配置于同一面的薄膜电容器。薄膜电容器(1)具备具有未被粗面化的中心部分(13)和被粗面化的上表面(11)的金属箔(10)、覆盖金属箔(10)的被粗面化的上表面(11)的电介质膜(D)、经由设置于电介质膜(D)的开口部与金属箔(10)的未被粗面化的中心部分(13)相接的电极层(31)、以及与电介质膜( |
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