Semiconductor device
The invention provides a semiconductor device including bit lines. In some embodiments, a semiconductor device includes a substrate including a plurality of active regions defined by a device isolation layer; a plurality of bit lines extending along a first horizontal direction on the substrate; a b...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention provides a semiconductor device including bit lines. In some embodiments, a semiconductor device includes a substrate including a plurality of active regions defined by a device isolation layer; a plurality of bit lines extending along a first horizontal direction on the substrate; a bit line contact between a first active region of the plurality of active regions and a first bit line of the plurality of bit lines on the first active region; and an active pad on a second active region adjacent to the first active region among the plurality of active regions. The bit line contact includes a first contact layer and a second contact layer on the first contact layer. The active pad is disposed to face the bit line contact.
本公开提供了包括位线的半导体器件。在一些实施方式中,半导体器件包括:衬底,包括由器件隔离层界定的多个有源区;在衬底上沿第一水平方向延伸的多条位线;在所述多个有源区中的第一有源区与所述多条位线中的在第一有源区上的第一位线之间的位线接触;以及在所述多个有源区中与第一有源区相邻的第二有源区上的有源焊盘。位线接触包括第一接触层和在第一接触层上的第二接触层。有源焊盘设置为面向位线接触。 |
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