Cross-gate cut gate link in semiconductor device

Techniques for forming an integrated circuit with gate dicing between pairs of adjacent semiconductor devices. At least one of those adjacent pairs of semiconductor devices includes a conductive link (e.g., a bridge) that cuts through the gates to connect adjacent gates together. In one example, adj...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: RAMANATHAN MADHUSUDAN, KHANDELWAL NIKHIL, ACHARYA, SUNIL, LAKHANI ASHOK KUMAR, O 'BRIEN THOMAS, ENGEL CHRISTOPHER J, GULER LEONARD P, GANESAN KARTHIK, LUTHRA PRAVEEN KUMAR, ZHU, BIN, LIU SHIWEN
Format: Patent
Sprache:chi ; eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!