ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOF

An electronic package and a method of fabricating the same are mainly provided with an electronic structure and a wall structure surrounding the electronic structure on a carrier structure, a heat-conducting layer is disposed on the electronic structure, and a heat sink covers the wall structure and the heat-conducting layer, so that thermal stress is effectively dispersed through the configuration of the wall structure, and the heat dissipation performance is improved. Therefore, the warping amount of the electronic structure and the heat dissipation body can be effectively controlled. 一种电子封装件及其制法，主要于承载结构上设置电子结构与一环绕该电子结构的墙结构，且将导热层设于该电子结构上，再以散热件遮盖该墙结构与该导热层，故通过该墙结构的配置，以有效分散热应力，致能有效控制该电子结构及散热体的翘曲量。