Semiconductor package including glass core substrate and method of manufacturing same

Provided is a semiconductor package capable of minimizing the size of a silicon (Si) interposer and minimizing warpage of a package substrate while maintaining a chip-to-chip connection function. The semiconductor package includes: a package substrate including a glass core substrate, a silicon (Si) bridge interposer, and a multilayer wiring layer disposed below the glass core substrate and the Si bridge interposer; and at least two semiconductor devices stacked on the package substrate, in which a cavity is formed in a central portion of the glass core substrate, and a Si bridge insert is embedded in the cavity. 提供了一种半导体封装，该半导体封装能够在保持芯片到芯片连接功能的同时最小化硅(Si)插入件的尺寸并最小化封装衬底的翘曲。该半导体封装包括：封装衬底，包括玻璃芯衬底、硅(Si)桥插入件、以及设置在玻璃芯衬底和Si桥插入件下方的多层布线层；以及至少两个半导体器件，堆叠在封装衬底上，其中，腔体形成在玻璃芯衬底的中心部分中，并且Si桥插入件嵌入在腔体中。