Atomic layer deposition coating method

The invention discloses an atomic layer deposition coating method, a to-be-coated workpiece is placed in a process cavity, the to-be-coated workpiece is provided with a to-be-coated area which is arranged upwards, and the method comprises the following steps when blowing is carried out in the coating process: providing first blowing airflow, the first purging airflow is blown out towards the to-be-plated area from a first height above the to-be-plated area; providing a second purging airflow, wherein the second purging airflow is blown out from a second height above the to-be-plated area to the to-be-plated area; the density of the first purging airflow is smaller than that of the second purging airflow, and the first height is larger than the second height relative to the to-be-plated area. Compared with the prior art, undissolved gas on the reaction surface and by-products generated by reaction can be effectively purged in the coating process, the cleanliness of the reaction surface can be improved, and the