Hot-pressing die and method for adjusting warping of copper-clad ceramic substrate by adopting hot-pressing die
The invention provides a hot pressing die and a method for adjusting warping of a copper-clad ceramic substrate using the same, the hot pressing die comprises a base and a cover plate, the surface of one side of the base is a concave surface, the surface of one side of the cover plate is a convex su...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention provides a hot pressing die and a method for adjusting warping of a copper-clad ceramic substrate using the same, the hot pressing die comprises a base and a cover plate, the surface of one side of the base is a concave surface, the surface of one side of the cover plate is a convex surface, the concave surface and the convex surface are arranged in a matching manner, and the concave surface and the convex surface are matched with each other. A product is placed between the concave surface and the convex surface for hot pressing treatment; the maximum depth of the concave surface is 0.15 to 0.25 mm; the adjusting method comprises the steps that a product is placed in a hot pressing mold, heating hot pressing and cooling treatment are carried out, and warping of the product is completed; the copper-clad ceramic substrate is subjected to hot-pressing shaping treatment by adopting the specially-made hot-pressing mold, warping of the copper-clad ceramic substrate in different directions and sizes is |
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