FLUX COMPOSITION, SOLDER COMPOSITION, AND ELECTRONIC SUBSTRATE

The present invention relates to a flux composition comprising (A) a resin, (B) an activator, and (C) a solvent, in which the (C) component comprises: (C1) a solvent having a boiling point of more than 250 DEG C and a viscosity of more than 10 mPa.s at 20 DEG C; and (C2) a glycol-based solvent havin...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SHIMOISHI, RYUTARO, ISHIGAKI KOICHI, YAMASHITA NOBUHIRO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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