FLUX COMPOSITION, SOLDER COMPOSITION, AND ELECTRONIC SUBSTRATE

The present invention relates to a flux composition comprising (A) a resin, (B) an activator, and (C) a solvent, in which the (C) component comprises: (C1) a solvent having a boiling point of more than 250 DEG C and a viscosity of more than 10 mPa.s at 20 DEG C; and (C2) a glycol-based solvent havin...

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Bibliographische Detailangaben
Hauptverfasser: SHIMOISHI, RYUTARO, ISHIGAKI KOICHI, YAMASHITA NOBUHIRO
Format: Patent
Sprache:chi ; eng
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Zusammenfassung:The present invention relates to a flux composition comprising (A) a resin, (B) an activator, and (C) a solvent, in which the (C) component comprises: (C1) a solvent having a boiling point of more than 250 DEG C and a viscosity of more than 10 mPa.s at 20 DEG C; and (C2) a glycol-based solvent having a boiling point of 250 DEG C or less, a resistance value of 60-80 Momega, and two hydroxyl groups per molecule. 本发明涉及一种助焊剂组合物,其包含(A)树脂、(B)活化剂和(C)溶剂,其中,所述(C)成分包含:(C1)沸点超过250℃,20℃下的粘度超过10mPa·s的溶剂;和(C2)沸点为250℃以下,电阻值为60MΩ以上且80MΩ以下,1分子中具有2个羟基的二醇类溶剂。