Electronic ceramic cleaning process for packaging shell

The invention discloses an electronic ceramic cleaning process for a packaging shell. The electronic ceramic cleaning process comprises the following steps of oil removal, water washing, acid pickling, water washing, cleaning, water washing and drying. Compared with the prior art, the method has the advantages that the electroplated ceramic substrate and the ceramic shell are cleaned, residual ions in ceramic gaps are removed under the condition that ceramic, metal materials and plating layers are not damaged, water vapor adsorption in the service process is avoided, and the insulation resistance of the ceramic substrate and the ceramic shell is improved. 本发明公开了一种用于封装外壳的电子陶瓷清洗工艺，包括以下步骤：除油、水洗、酸洗、水洗、清洗、水洗、烘干。相较于现有技术，本发明通过对电镀后的陶瓷基板及陶瓷外壳进行清洗，在不损伤陶瓷、金属材料、镀层的情况下去除陶瓷空隙中的残余离子，避免服役过程中的水汽吸附，提升陶瓷基板及陶瓷外壳的绝缘电阻。