Molded power module and power module assembly

A molded power module (2) comprises:-a substrate (12) comprising an upper conductive layer (5, 6); the invention relates to a semiconductor device (10, 10 ') comprising a substrate (12), an upper conductive layer (5, 6) on the substrate (12), at least one semiconductor (10, 10') on the upp...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	OLSEN KLAUS, M ¨ 1 HLFELD, OLE, ULRICH HOLGER, BOISEN, HANS, PETER
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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