DIRECT BONDED FRAME WAFER

DIRECT BONDED FRAME WAFER

A bonded structure includes a frame element having a cavity formed through its thickness. The frame element is directly bonded to the first element on a first side and is directly bonded to the second element on a second side, thereby closing the cavity. The frame element may include a through subst...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: FOUNTAIN JR G G, HUDSON, GARY, C, MIRKARIMI LAURA WILLS, GAO GUILIAN
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A bonded structure includes a frame element having a cavity formed through its thickness. The frame element is directly bonded to the first element on a first side and is directly bonded to the second element on a second side, thereby closing the cavity. The frame element may include a through substrate via (TSV). Redundant conductive contact pads may be formed in the bonding layer for enhanced direct bonding quality and reliability. 一种结合结构包括框架元件，该框架元件具有穿过其厚度而形成的腔体。该框架元件在第一侧被直接结合到第一元件，并且在第二侧被直接结合到第二元件，从而封闭腔体。该框架元件可以包括衬底通孔(TSV)。可以在结合层中形成冗余的导电接触焊盘，以用于增强直接结合质量和可靠性。