Packaging equipment for electronic component manufacturing

The invention relates to the technical field of electronic component packaging, and discloses electronic component manufacturing packaging equipment which comprises a mounting table, a mounting shaft is rotationally connected to the top of the mounting table, and a driving motor fixedly connected wi...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: LUO HUIBIN, ZHOU XIQI, TAN XIANJUN, BAO YUELIANG, YAN SHICHEN
Format: Patent
Sprache:chi ; eng
Schlagworte:
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Beschreibung
Zusammenfassung:The invention relates to the technical field of electronic component packaging, and discloses electronic component manufacturing packaging equipment which comprises a mounting table, a mounting shaft is rotationally connected to the top of the mounting table, and a driving motor fixedly connected with the mounting table is fixedly connected to the bottom end of the mounting shaft through a coupler. The packaging equipment comprises a gluing packaging mechanism, a mounting shaft is arranged on the top of the gluing packaging mechanism, a mounting disc is fixedly connected to the top end of the mounting shaft, a plurality of mounting grooves are formed in the top of the mounting disc, and clamping mechanisms are arranged in the mounting grooves. According to the invention, the proper gluing pipe is selected to glue and package the pins of the electronic components, so that the gluing and packaging of the electronic components with different sizes of pins are realized, the applicability of packaging the pins of