Bonding structure, semiconductor chip and manufacturing method thereof

The invention provides a semiconductor chip, a joint structure and a manufacturing method of the semiconductor chip. The semiconductor chip comprises a semiconductor substrate and an interconnection structure. The semiconductor substrate comprises a plurality of semiconductor elements; the interconnection structure is configured on the semiconductor substrate and is electrically connected with the semiconductor element, the semiconductor substrate or the interconnection structure comprises at least one conductor, the at least one conductor comprises a first conductive region and a second conductive region connected with the first conductive region, the first conductive region comprises randomly oriented metal, and the second conductive region comprises randomly oriented metal. And the second conductive region comprises directional metal. 本公开提供一种半导体芯片、接合结构以及半导体芯片的制造方法，该半导体芯片包括半导体衬底以及互连结构；半导体衬底包括多个半导体元件；互连结构配置于半导体衬底上且与半导体元件电性连接，其中半导体衬底或互连结构包括至少一个导体，且至少一个导体包括第一导电区域以及与第一导电区域连接的第二导电区域，而第一导电区域包括随机定向金属，且第二导电区域包括定向金属