Packaging structure and packaging method of flip chip

The invention discloses a packaging structure and a packaging method of a flip chip. The packaging structure of the flip chip comprises a carrier plate; the at least two metal connecting pieces penetrate through the carrier plate and form bonding pads on the two sides of the carrier plate; the chip is welded on the bonding pad on one side of the metal connecting piece; wherein a dam is formed between the two adjacent bonding pads on the other side far away from the chip, so as to separate the two adjacent bonding pads; and the packaging layer is arranged on one side, close to the chip, of the carrier plate and wraps and packages the chip. Through the mode, the risks of bridge cutoff, bottom windowing deviation of the packaging structure and the like when the packaging structure is installed on the substrate after packaging is completed are avoided, the problems of short circuit and the like caused by tin connection between pins of the packaging structure of the flip chip are solved, and the requirements of sm