Method of forming semiconductor package and method of forming plurality of semiconductor packages

Methods of forming a semiconductor package and methods of forming a plurality of semiconductor packages are provided. A method of forming a semiconductor package includes: providing a substrate; mounting a semiconductor die on the substrate, wherein a major surface of the semiconductor die faces away from the substrate; forming a vertical interconnect element on the main surface of the semiconductor die; forming an encapsulant on the substrate that encapsulates the semiconductor die; exposing the vertical interconnect element at an upper surface of the encapsulant; forming a first stage metal disk on an upper surface of the encapsulant in contact with the exposed vertical interconnect element; and forming a structured metal region on the upper surface of the encapsulant, where forming the structured metal region includes structuring the first stage metal disk. 提供了形成半导体封装的方法和形成多个半导体封装的方法。形成半导体封装的方法包括：提供基板；将半导体管芯安装在基板上，其中半导体管芯的主表面背向基板；在半导体管芯的主表面上形成垂直互连元件；在基板上形成密封半导体管芯的密封剂；在密封剂的上表面处暴露垂直互连元件；在密封剂的上表面上形成与暴露的垂直互连元件