Device module, tandem assembly device and contact spring
The invention relates to a device module (10) for a multi-pole tandem assembly device (1) consisting of at least two device modules (10, 20, 30, 40), having a module housing (12) with only one unit-divided width (B), having a front face (13), a fastening face (14) opposite the front face (13), and a...
Gespeichert in:
Hauptverfasser: | , |
---|---|
Format: | Patent |
Sprache: | chi ; eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | The invention relates to a device module (10) for a multi-pole tandem assembly device (1) consisting of at least two device modules (10, 20, 30, 40), having a module housing (12) with only one unit-divided width (B), having a front face (13), a fastening face (14) opposite the front face (13), and a narrow face (15) and a wide face (16) connecting the front face and the fastening face, the device module has a movable contact (17), which is arranged in the module housing (12) and forms a switching contact with a fixed contact (18), which is also arranged in the module housing (12), and a contact spring (100), which consists of a helical torsion spring (110) and a compression spring (120).
本发明涉及一种设备模块(10),其用于由至少两个设备模块(10、20、30、40)构成的多极串接组装设备(1),设备模块具有模块壳体(12),模块壳体具有仅一个划分单位的宽度(B),模块壳体具有正面(13)、与正面(13)相对的固定面(14)以及连接正面和固定面的窄面(15)和宽面(16),设备模块具有移动触点(17),移动触点布置在模块壳体(12)中并与同样布置在模块壳体(12)中的固定触点(18)形成开关接触,设备模块具有接触弹簧(100),接触弹簧由螺旋扭力弹簧(110)和压缩弹簧(120)构成。 |
---|