LASER PROCESSING APPARATUS AND LASER PROCESSING METHOD

The present invention addresses the problem of improving the processing quality of a substrate which is irradiated with laser light and subjected to hole processing. The solution of the present invention is a laser processing apparatus and a laser processing method, the laser processing apparatus comprising: a stage (20) capable of supporting a substrate (10); a laser irradiation unit (30) that irradiates laser light (40) on the substrate (10) supported by the stage (20); a temperature and humidity measurement unit (60) that measures the temperature and humidity of the periphery of the substrate (10) supported by the stage (20); and a control unit (70) that finds the laser irradiation position on the substrate (10) on the basis of the temperature and humidity measurement results obtained by the temperature and humidity measurement unit (60). The control unit (70) corrects and finds the laser irradiation position on the substrate (10) for the laser irradiation position registered in advance on the basis of the