Adhesive film for circuit connection, circuit connection structure, and method for producing same

The invention discloses an adhesive film for circuit connection. The adhesive film for circuit connection is provided with: a first adhesive layer containing conductive particles, a cured product of a photocurable resin component, and a first thermosetting resin component; and a second adhesive layer provided on the first adhesive layer and containing a second thermosetting resin component. The photocurable resin component contains a radical polymerizable compound and a photoradical polymerization initiator. The photoradical polymerization initiator contains a compound having an oxime ester structure. 本发明公开了一种电路连接用黏合剂膜。该电路连接用黏合剂膜具备：第1黏合剂层，含有导电粒子、光固化性树脂成分的固化物及第1热固性树脂成分；及第2黏合剂层，设置在第1黏合剂层上且含有第2热固性树脂成分。光固化性树脂成分包含自由基聚合性化合物及光自由基聚合引发剂。光自由基聚合引发剂包含具有肟酯结构的化合物。