Electric interconnection assembly
The electric interconnection assembly comprises a ceramic circuit board and a main control circuit board, the front end of the ceramic circuit board extends out to be duckbilled, the ceramic circuit board is matched with a blind groove of the main control circuit board, and the position deviation of...
Gespeichert in:
| Hauptverfasser: | , , , |
|---|---|
| Format: | Patent |
| Sprache: | chi ; eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| Zusammenfassung: | The electric interconnection assembly comprises a ceramic circuit board and a main control circuit board, the front end of the ceramic circuit board extends out to be duckbilled, the ceramic circuit board is matched with a blind groove of the main control circuit board, and the position deviation of the ceramic circuit board and the main control circuit board is controlled with the assistance of an alignment mark on the ceramic circuit board. The ceramic circuit board is welded on the main control circuit board, a first ground bonding pad and a first signal bonding pad are arranged on the ceramic circuit board, a second ground bonding pad which corresponds to the first ground bonding pad and is equal in length and width is arranged on the main control circuit board, and a second signal bonding pad which corresponds to the first signal bonding pad and is equal in length and width is arranged on the main control circuit board. The length of the first ground bonding pad ranges from 0.6 mm to 1.0 mm, and the widt |
|---|