Semiconductor device

There is provided a semiconductor device including: a first substrate including a first semiconductor substrate and a first wiring layer; and a second substrate including a second semiconductor substrate and a second wiring layer including a plurality of wirings, in which the second semiconductor substrate includes a polishing adjustment portion, in which the polishing adjustment portion surrounds at least a portion of the plurality of wirings in a plan view, and in which the polishing adjustment portion is aligned with the plurality of wirings. At least a portion of the polishing adjustment portion is provided in the thickness direction of the second semiconductor substrate. 提供了一种半导体装置，半导体装置包括：第一基板，所述第一基板包括第一半导体基板和第一配线层；第二基板，所述第二基板包括第二半导体基板和包括多条配线的第二配线层，其中，所述第二半导体基板包括抛光调整部，其中，在平面图中，所述抛光调整部围绕所述多条配线的至少一部分，并且，所述抛光调整部的至少一部分设置在所述第二半导体基板的厚度方向。