Bonding device and bonding method

Provided are a bonding apparatus and a bonding method, the bonding apparatus being provided with: a holding unit having, on an adsorption surface for adsorbing a substrate, an outer adsorption unit for adsorbing an outer peripheral portion of the substrate, and an inner adsorption unit for adsorbing an outer peripheral portion of the substrate; and an inner side adsorption part which adsorbs a part of the substrate closer to the radial inner side than the outer side adsorption part. A relative holding part which is disposed opposite to the holding part and holds a substrate other than the substrate bonded to the substrate; a moving unit that moves the outer suction unit in the vertical direction with respect to the suction surface with respect to the inner suction unit; and a control unit that controls the movement of the outer adsorption unit with respect to the inner adsorption unit, thereby controlling the strain generated on the substrate adsorbed on the adsorption surface. 提供一种接合装置和接合方法，该接合装置具备：保持部，其在用于吸