MULTILAYER ELECTRONIC COMPONENT

The present disclosure provides a multilayer electronic component. The multilayer electronic component includes: a body including dielectric layers and internal electrodes alternately disposed with the dielectric layers; and an external electrode disposed on the main body, in which the external electrode includes an electrode layer connected to the internal electrode and including Cu, a first plated portion disposed on the electrode layer, and a second plated portion disposed on the first plated portion, the first plating portion includes a first Ni layer in contact with the electrode layer and an intermetallic compound layer disposed on the first Ni layer and including an intermetallic compound including at least one of Ni and Sn. 本公开提供了一种多层电子组件。所述多层电子组件包括：主体，包括介电层和与所述介电层交替设置的内电极；以及外电极，设置在所述主体上，其中，所述外电极包括连接到所述内电极并包括Cu的电极层、设置在所述电极层上的第一镀覆部和设置在所述第一镀覆部上的第二镀覆部，其中，所述第一镀覆部包括与所述电极层接触的第一Ni层以及设置在所述第一Ni层上并包括金属间化合物的金属间化合物层，所述金属间化合物包括Ni和Sn中的至少一种。