Film thickness and component monitoring device and method
The invention provides a film layer thickness and component monitoring device and method. The device comprises a vacuum cavity, a diamond matrix to be coated, a film material disc, a detection array, a laser emission module and an analysis module. The coating monitoring device provided by the invent...
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| creator | PENG QINJUN SHEN YU BO YONG ZHOU SIBO WEN YA |
| description | The invention provides a film layer thickness and component monitoring device and method. The device comprises a vacuum cavity, a diamond matrix to be coated, a film material disc, a detection array, a laser emission module and an analysis module. The coating monitoring device provided by the invention can accurately monitor the thickness and components of the pre-laid film layer in real time, overcomes the problem that the components and the thickness of the film layer cannot be monitored in real time in the process of coating a middle film layer silicon carbide layer/film layer on diamond, and provides a principle of obtaining THz waves based on a diamond Raman effect; by measuring the strength, the waveform and the propagation speed of the THz wave radiated by the diamond, the thickness and the components of the silicon carbide layer/film layer evaporated on the diamond substrate are detected, the thickness and the components of the film layer of the diamond coating are detected, and uneven coating and was |
| format | Patent |
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The device comprises a vacuum cavity, a diamond matrix to be coated, a film material disc, a detection array, a laser emission module and an analysis module. The coating monitoring device provided by the invention can accurately monitor the thickness and components of the pre-laid film layer in real time, overcomes the problem that the components and the thickness of the film layer cannot be monitored in real time in the process of coating a middle film layer silicon carbide layer/film layer on diamond, and provides a principle of obtaining THz waves based on a diamond Raman effect; by measuring the strength, the waveform and the propagation speed of the THz wave radiated by the diamond, the thickness and the components of the silicon carbide layer/film layer evaporated on the diamond substrate are detected, the thickness and the components of the film layer of the diamond coating are detected, and uneven coating and was</description><language>chi ; eng</language><subject>INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES ; MEASURING ; MEASURING ANGLES ; MEASURING AREAS ; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS ; MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS ; PHYSICS ; TESTING</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240917&DB=EPODOC&CC=CN&NR=118655075A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,309,781,886,25566,76549</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240917&DB=EPODOC&CC=CN&NR=118655075A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>PENG QINJUN</creatorcontrib><creatorcontrib>SHEN YU</creatorcontrib><creatorcontrib>BO YONG</creatorcontrib><creatorcontrib>ZHOU SIBO</creatorcontrib><creatorcontrib>WEN YA</creatorcontrib><title>Film thickness and component monitoring device and method</title><description>The invention provides a film layer thickness and component monitoring device and method. 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| language | chi ; eng |
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| subjects | INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MEASURING MEASURING ANGLES MEASURING AREAS MEASURING IRREGULARITIES OF SURFACES OR CONTOURS MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS PHYSICS TESTING |
| title | Film thickness and component monitoring device and method |
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