Film thickness and component monitoring device and method
The invention provides a film layer thickness and component monitoring device and method. The device comprises a vacuum cavity, a diamond matrix to be coated, a film material disc, a detection array, a laser emission module and an analysis module. The coating monitoring device provided by the invent...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention provides a film layer thickness and component monitoring device and method. The device comprises a vacuum cavity, a diamond matrix to be coated, a film material disc, a detection array, a laser emission module and an analysis module. The coating monitoring device provided by the invention can accurately monitor the thickness and components of the pre-laid film layer in real time, overcomes the problem that the components and the thickness of the film layer cannot be monitored in real time in the process of coating a middle film layer silicon carbide layer/film layer on diamond, and provides a principle of obtaining THz waves based on a diamond Raman effect; by measuring the strength, the waveform and the propagation speed of the THz wave radiated by the diamond, the thickness and the components of the silicon carbide layer/film layer evaporated on the diamond substrate are detected, the thickness and the components of the film layer of the diamond coating are detected, and uneven coating and was |
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