Acidic copper etching solution and preparation method thereof

The invention discloses an acidic copper etching solution and a preparation method thereof, and belongs to the technical field of metal surface chemical treatment, the acidic copper etching solution comprises the following raw materials by mass: 3-6% of copper chloride, 5-10% of hydrochloric acid, 0...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	GONG SHENG, WU JIFENG, WANG SUO, HE YEQIAN, WANG WEIKANG, HUANG DEXIN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE
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